Ahead of GOCarbonFibre 2019 conference, we grabbed 60 seconds with Nicholas Abbatiello, Distinguished Engineer at Dell Technologies to get a sneak peek of what we can expect from his presentation. Here's what he had to say...
Your presentation focuses on “The Use of Carbon Fibre in the Electronics Industry,” could you please give us a sneak peak of what our audience can expect to hear?
I will discuss how we approached the composites in high volume electronics applications. The evolution from thermoset to thermoplastic and the technology integration required to mass produce carbon fibre parts.
What are the main challenges and opportunities in the carbon fibre and composites industry?
The main challenges for the carbon fibre composites industry is the capacity to produce laminate materials. The capacity expansion requires capital investments and the lead times for expansion are longer than the consumer electronics can accept.
What do you see as the most significant shift for the carbon fibre and composites industry in the past two years?
The most significant shifts have been in the transition from thermosets to thermoplastics. We once used 100% thermoset, we are now 100% thermoplastic. There are even more advantages than we originally anticipated.
Why do you feel it’s important for people to attend GOCarbonFibre 2019?
I think its always important to see how other industries are solving the problems in the use of composites.
